A study shows how high-thermal dielectrics outperform FR-4 for bulk heat spreading, with surface-mount thermal bridges ...
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...
Our appetite for new gadgets is resulting in a huge e-waste problem, with just a fraction of the 50 million tonnes of tech thrown away each year being recycled. Looking to tackle a significant part of ...
Designers are familiar with rigid print circuit boards (PCBs) typified by the classic FR4 substrate as well as more advanced substrates which are compatible with multi-gigahertz applications. It’s ...
A new supply-chain report suggests that Apple is seeking to be an early player in what some believe will be the next big thing in chip development: printed circuit boards (PCBs) made from glass ...